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Final A Adhesive Back, 8" (Pk/5)

High density, non-woven, low-nap porous polyurethane pad for use with diamond (1-0.05 micron), colloidal suspensions or alumina. Excellent for final polishing a wide variety of materials. Especially effective in eliminating smearing and pullout when preparing soft metals such as copper and aluminum, porous structures/materials, or when preparing materials for SEM...


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